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PRELIMINARY DATA SHEET
GaAs INTEGRATED CIRCUIT
UPG2150T5L
GaAs MMIC SP3T SWITCH FOR BLUETOOTH & 802.11b/g
DESCRIPTION
The uPG2150T5L is a GaAs MMIC SP3T switch for Bluetooth & wireless LAN. The device can operate from
500MHz to 2.5GHz, having the low insertion loss and high isolation. FEATURES
* Operating frequency * Low insertion loss * Handling power * Control voltage * High isolation : f = 0.5 to 2.5 GHz : LINS = 0.5 dB TYP. @ f = 2.5GHz, ANT to RF1,RF2 0.6dB TYP. @ f = 2.5 GHz, ANT to RF3 : Pin (1 dB) = +31 dBm TYP. @ f = 2.5GHz, ANT to RF1,RF2 +25 dBm TYP. @ f = 2.5 GHz, ANT to RF3 : Vcont = +2.85 V/0 V : ISL = 35dB TYP. @ f =2.5 GHz, ANT to RF3 (ON) 18 dB T Y P. @ f = 2. 5 GHz , A N T to R F 1 , 2( O N) * 12-pin plastic TSQFN package (2.0 x 2.0 x 0.37 mm)
APPLICATION
* Bluetooth & 802.11b/g
ORDERING INFORMATION
Part Number UPG2150T5L-E2-A Package 12-pin plastic TSQFN Marking 2150 Supplying Form * Embossed tape 8 mm wide * Pin 10,11,12 face the perforation side of the tape * Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: uPG2150T5L
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Document No. 1st version Date Published DEC. 2004 CP(K)
UPG2150T5L
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No. Pin Name ANT GND Vcont2 RF2 GND RF3 Vcont3 GND Vcont1 RF1 GND GND

1 2 3 4 5 6 7 8 9 10 11 12
TRUTH TABLE
Vcont1 2.3 to 3.6 V 0 0.2 V 0 0.2 V Vcont2 0 0.2 V 2.3 to 3.6 V 0 0.2 V Vcont3 0 0.2 V 0 0.2 V 2.3 to 3.6 V ANT-RF1 ON OFF OFF ANT-RF2 OFF ON OFF ANT-RF3 OFF OFF ON
ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified)
Parameter Switch Control Voltage Input Power@ Ant to RF1,2 Input Power@ Ant to RF3 Operating Ambient Temperature Storage Temperature Symbol Vcont Pin Pin TA Tstg Ratings -6.0 to +6.0 +34 +28 -45 to +85 -55 to +150
Note 1
Unit V dBm dBm C C
Notes 1. | Vcont1 - Vcont2 | 6.0 V 2. Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB, TA = +85C
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PRELIMINARY DATA SHEET
UPG2150T5L
RECOMMENDED OPERATING RANGE (TA = +25C)
Parameter Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) Symbol f Vcont (H) Vcont (L) MIN. 0.5 2.3 -0.2 TYP. - 2.85 0 MAX. 2.5 3.6 0.2 Unit GHz V V
ELECTRICAL CHARACTERISTICS (TA =+25C, Vcont = 2.85V/0 V, ZO = 50 , DC blocking capacitors value: 56 pF, Each port, unless otherwise specified)
Parameter Insertion Loss Symbol LINS Pass ANT to RF1,2 Test Conditions f = 0.5 to 1.0GHz f = 1.0 to 2.0GHz f = 2.0 to 2.5GHz ANT to RF3 f = 0.5 to 1.0GHz f = 1.0 to 2.0GHz f = 2.0 to 2.5GHz Isolation ISL ANT to RF3 OFF @ANT to RF1,2 ON RF1 to RF3 OFF @ANT-RF1ON ANT to RF1 OFF @ANT to RF2,3 ON ANT to RF2 OFF @ANT to RF1,3 ON Input Return Loss Output Return Loss Switch Control Current Input Power at 1dB Compression Point RLin RLout Icont Pin (1 dB) ANT to RF1,2,3 ANT to RF1,2,3 ANT to RF1,2,3 ANT to RF1,2, f = 2.0 to 2.5GHz f = 0.5 to 2.5GHz f = 0.5 to 2.5GHz RF Non f = 1.0 GHz f = 2.0 GHz f = 2.5 GHz ANT to RF3 f = 1.0 GHz f = 2.0 GHz f = 2.5 GHz Switch Control Speed tSW ANT to RF1,2,3 - 50 - ns 20 25 - dBm 28 31 - f = 2.0 to 2.5GHz f = 0.5 to 1.0GHz f = 1.0 to 2.0GHz f = 0.5 to 1.0GHz f = 1.0 to 2.0GHz MIN. - - - - - - 29 30 30 23 17 15 15 15 - TYP. 0.40 0.45 0.50 0.45 0.55 0.60 32 35 35 26 20 18 20 20 0.1 - - 1.0 - MAX. 0.55 0.60 0.65 0.60 0.70 0.75 - Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB
A
dBm
PRELIMINARY DATA SHEET
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UPG2150T5L
EVALUATION CIRCUIT
C1 56 F
C2 1000pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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PRELIMINARY DATA SHEET
UPG2150T5L
PACKAGE DIMENSIONS
PRELIMINARY DATA SHEET
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UPG2150T5L
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering C o n d i t i o n s Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180 C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) VPS Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150 C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 215C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 VP215 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120C or below
Caution Do not use different soldering methods together (except for partial heating).
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PRELIMINARY DATA SHEET
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Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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